The ISL6312A four-phase PWM control IC provides a precision voltage regulation system for advanced microprocessors. The integration of power MOSFET drivers into the controller IC marks a departure from the separate PWM controller and driver configuration of previous multiphase product families. By reducing the number of external parts, this integration is optimized for a cost and space saving power management solution. One outstanding feature of this controller IC is its multi-processor compatibility, allowing it to work with both Intel and AMD microprocessors. Included are programmable VID codes for Intel VR10, VR11, as-well-as AMD DAC tables. A unity gain, differential amplifier is provided for remote voltage sensing, compensating for any potential difference between remote and local grounds. The output voltage can also be positively or negatively offset through the use of a single external resistor. The ISL6312A also includes advanced control loop features for optimal transient response to load apply and removal. One of these features is highly accurate, fully differential, continuous DCR current sensing for load-line programming and channel current balance. Active pulse positioning (APP) modulation is another unique feature, allowing for quicker initial response to high di/dt load transients. This controller also allows the user the flexibility to choose between PHASE detect or LGATE detect adaptive deadtime schemes. This ability allows the ISL6312A to be used in a multitude of applications where either scheme is required. Protection features of this controller IC include a set of sophisticated overvoltage, undervoltage, and overcurrent protection. Furthermore, the ISL6312A includes protection against an open circuit on the remote sensing inputs. Combined, these features provide advanced protection for the microprocessor and power system.

Features

  • Integrated multiphase power conversion
  • 2-phase or 3-phase operation with internal drivers
  • 4-phase operation with external PWM driver signal
  • Precision core voltage regulation
  • Differential remote voltage sensing
  • ±0.5% system accuracy over-temperature
  • Adjustable reference-voltage offset
  • Optimal transient response
  • Active pulse positioning (APP) modulation
  • Adaptive phase alignment (APA)
  • Fully differential, continuous DCR current sensing
  • Accurate load-line programming
  • Precision channel current balancing
  • User selectable adaptive deadtime scheme
  • PHASE detect or LGATE detect for application flexibility
  • Variable gate drive bias: 5V to 12V
  • Multi-processor compatible
  • Intel VR10 and VR11 modes of operation
  • AMD mode of operation
  • Microprocessor voltage identification inputs
  • 8-bit DAC
  • Selectable between intel's extended VR10, VR11, AMD 5-bit, and AMD 6-bit DAC tables
  • Dynamic VID technology
  • Overcurrent protection
  • Load current indicator
  • Multi-tiered overvoltage protection
  • Digital soft-start
  • Selectable operation frequency up to 1.5MHz per phase
  • Pb-free (RoHS compliant)

Product Options

Part Number Part Status Pkg. Type Carrier Type MOQ Buy Sample
Active QFN Tube 43
Availability
Active QFN Reel 4000
Availability
Active QFN Tube 43
Availability
Active QFN Reel 4000
Availability

Documentation & Downloads

Title language Type Format File Size Date
Datasheets & Errata
ISL6312A Datasheet Datasheet PDF 1.86 MB
Application Notes & White Papers
Five Easy Steps to Create a Multi-Load Power Solution White Paper PDF 846 KB
AN1681: Grounding Techniques Application Note PDF 509 KB
AN1684: Nonideality of Ground Application Note PDF 397 KB
PCNs & PDNs
PCN14036 - Wafer fabrication Site Change for Listed Intersil Products - Palm Bay, Florida Product Change Notice PDF 294 KB
PCN13025 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li , Taiwan and STATS ChipPAC (SCM) - Kuala Lumpur, Mal Product Change Notice PDF 106 KB
PCN13009 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li (ASECL), Taiwan and STATS ChipPAC (SCM) - Kuala Lump Product Change Notice PDF 173 KB
PCN10055 - Alternate Bond Wire Material for Assembly of the Listed Intersil DFN/QFN Packaged Products - STATS ChipPAC Malaysia Product Change Notice PDF 248 KB
Other
ISL6312A 4-Phase iSim:PE Model Schematic SXSCH 466 KB
ISL6312A 3-Phase iSim:PE Model Schematic SXSCH 394 KB
ISL6312A 2-Phase iSim:PE Model Schematic SXSCH 345 KB

Software & Tool Pages

Title Type Description Company
iSim:PE Offline Simulation Tool Simulator iSim Personal Edition (iSim:PE) speeds the design cycle and reduces risk early in any project, identifying parts that can be used in current as well as next-generation designs. Renesas