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Winbond Electronics Corporation DRAM & Flash Solutions
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概览
简介
Solution Summary
Winbond provides a total memory solution including NOR Flash, NAND Flash and DRAM suitable for the R-Car family that requires external memory.
Features/Benefits
- Serial NOR: Quad / Octal SPI, 2Mb~2Gb, 1.8V and 3.3V, 100K cycles endurance
- Serial NAND: Quad / Octal SPI, 512Mb~4Gb, 1.8V and 3.3V, 100K cycles endurance
- ONFI NAND: ONFI 1.0, 1Gb~8Gb, 1.8V and 3.3V, 100K cycles endurance
- SDRAM: DDR1/2/3/4 64Mb~8Gb, LPDDR2/4/4x 512Mb~8Gb
- HyperRAM™: HyperBus, 32Mb~512Mb, 1.8V
产品对比
应用
应用
- Instrument Cluster
- DAS
- V2X
- Telematics
相关产品
| 文档标题
|
分类
|
购买 / 样片 |
|---|---|---|
| R-Car-S4 用于汽车服务器/通信网关的汽车片上系统 (SoC) |
R-Car汽车片上系统（SOC） | 购买 / 样片 |
| R-Car-H3e R-Car H3/H3e/H3e-2G 高端汽车片上系统 (SoC)，用于车载信息娱乐系统和集成驾驶舱 |
R-Car汽车片上系统（SOC） | 购买 / 样片 |
| R-Car-H3Ne R-Car H3N/H3Ne/H3Ne-1.7G 高端汽车片上系统 (SoC)，用于车载信息娱乐系统和集成驾驶舱 |
R-Car汽车片上系统（SOC） | 购买 / 样片 |
| R-Car-M3e R-Car M3/M3e/M3e-2G 汽车片上系统 (SoC)，中端汽车计算系统的理想选择 |
R-Car汽车片上系统（SOC） | 购买 / 样片 |
| R-Car-M3Ne R-Car M3N/M3Ne/M3Ne-2G 汽车片上系统 (SoC)，中型汽车计算系统的理想选择 |
R-Car汽车片上系统（SOC） | 购买 / 样片 |
| R-Car-E3e R-Car E3/E3e 汽车片上系统 (SoC)，用于 3D 图形仪表盘 |
R-Car汽车片上系统（SOC） | 购买 / 样片 |
| R-Car-D3e R-Car D3/D3e 汽车片上系统 (SoC)，用于 3D 图形仪表盘 |
R-Car汽车片上系统（SOC） | 购买 / 样片 |
| R-Car-V4H 在适用于自动驾驶Level 2+/Level 3 等级的低功耗片上系统上采用一流深度学习技术 |
R-Car汽车片上系统（SOC） | 购买 / 样片 |
| R-Car-V3H 针对车载立体前置摄像头应用优化的 SoC |
R-Car汽车片上系统（SOC） | 购买 / 样片 |
| R-Car-V3M 专为具有 ASIL 和深度学习功能的低价高效智能摄像头应用而设计的 SoC |
R-Car汽车片上系统（SOC） | 购买 / 样片 |
视频和培训
Automotive Cluster - Winbond W25M02GV & RH850/D1M2 (Winbond Electronics Corp. Japan)
Winbond Electronics Corp. Japan
Demonstrates the operation of automotive cluster system by the combination of Serial NAND and RH850/D1M2.
A trusted supplier of advanced memory products
From R&D through advanced manufacturing to dedicated customer service, Winbond Electronics Corporation is a total memory solutions provider.
Winbond’s product portfolio consists of specialty DRAM, mobile DRAM, code storage Flash memory, and TrustME®secure Flash memory products. The company serves customers in the communications, consumer electronics, automotive, industrial, and computer peripherals markets, supplying its products directly or via a global network of authorized distributors.
Winbond’s headquarters are in the Central Taiwan Science Park, and it operates wafer fabrication plants in Taichung and Kaohsiung in Taiwan. Subsidiaries in the USA, Japan, Israel, China, Hong Kong and Germany perform marketing operations and provide direct support to customers.
Winbond’s combination of advanced semiconductor technologies developed in-house and close relationships with customers support its position as a trusted supplier of memory products.
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