The ISL6262A is a two-phase buck converter regulator implementing Intel® IMVP-6+ protocol with embedded gate drivers. The two-phase buck converter uses two interleaved channels to effectively double the output voltage ripple frequency, and thereby reduce output voltage ripple amplitude with fewer components; lower component cost; reduced power dissipation; and smaller real estate area. The heart of the ISL6262A is the patented R3 Technology™, Intersil's Robust Ripple Regulator modulator. Compared with the traditional multiphase buck regulator, the R3 Technology™ has the fastest transient response. This is due to the R3 modulator commanding variable switching frequency during a load transient. Intel® Mobile Voltage Positioning (IMVP) is a smart voltage regulation technology, which effectively reduces power dissipation in Intel® Pentium processors. To boost battery life, the ISL6262A supports DPRSLPVR (deeper sleep), DPRSTP# and PSI# functions, and maximizes the efficiency via automatically enabling different phase operation modes. At heavy load operation of the active mode, the regulator commands the two phase continuous conduction mode (CCM) operation. While the PSI# is asserted with medium load in active mode, the ISL6262A smoothly disables one phase and operates in one-phase CCM. When the CPU enters deeper sleep mode, the ISL6262A enables diode emulation to maximize the efficiency at light load. For better system power management of the portable computer, the ISL6262A also provides a CPU power monitor output. The analog output at the power monitor pin can be fed into an A/D converter to report instantaneous or average CPU power. A 7-bit digital-to-analog converter (DAC) allows dynamic adjustment of the core output voltage from 0. 300V to 1. 500V. A 0. 5% system accuracy of the core output voltage over-temperature is achieved by the ISL6262A. A unity-gain differential amplifier is provided for remote CPU die sensing. This allows the voltage on the CPU die to be accurately measured and regulated per Intel® IMVP-6+ specifications. Current sensing can be realized using either lossless inductor DCR sensing, or precision resistor sensing. A single NTC thermistor network thermally compensates the gain and the time constant of the DCR variations.

Features

  • Precision Two/One-phase CORE Voltage Regulator
  • 0.5% System Accuracy Over-Temperature
  • Enhanced Load Line Accuracy
  • Internal Gate Driver with 2A Driving Capability
  • Dynamic Phase Adding/Dropping
  • Microprocessor Voltage Identification Input
  • 7-Bit VID Input
  • 0.300V to 1.500V in 12.5mV Steps
  • Support VID Change On-the-Fly
  • Multiple Current Sensing Schemes Supported
  • Lossless Inductor DCR Current Sensing
  • Precision Resistive Current Sensing
  • CPU Power Monitor
  • Thermal Monitor
  • User Programmable Switching Frequency
  • Differential Remote CPU Die Voltage Sensing
  • Static and Dynamic Current Sharing
  • Overvoltage, Undervoltage, and Overcurrent Protection
  • Pb-Free (RoHS Compliant)

Product Options

Part Number Part Status Pkg. Type Carrier Type MOQ Buy Sample
Active QFN Tube 43
Availability
Active QFN Reel 4000
Availability
Active QFN Tube 43
Availability
Active QFN Reel 4000
Availability

Documentation & Downloads

Title Other Languages Type Format File Size Date
Datasheets & Errata
ISL6262A Datasheet Datasheet PDF 1.27 MB
Application Notes & White Papers
Five Easy Steps to Create a Multi-Load Power Solution White Paper PDF 846 KB
AN1684: Nonideality of Ground Application Note PDF 397 KB
AN1681: Grounding Techniques Application Note PDF 509 KB
PCNs & PDNs
PCN15046 - Wafer Fabrication Site Change for Listed Intersil Products - Global Foundry P6 Process transfer to Palm Bay - Phase II Product Change Notice PDF 398 KB
PCN13063 - Alternate Manufacturing Site for Assembly of the Listed Intersil DFN/QFN Packaged Products Product Change Notice PDF 145 KB
PCN13060 - Test Site Change for the Listed Intersil Products Product Change Notice PDF 223 KB
PCN13024B - Alternate Manufacturing Site for Assembly of the Listed Intersil DFN/QFN Packaged Products - Canceled for select products Product Change Notice PDF 243 KB
PCN13025 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li , Taiwan and STATS ChipPAC (SCM) - Kuala Lumpur, Mal Product Change Notice PDF 106 KB
PCN13024 - Alternate Manufacturing Site for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering - Chung-Li, Taiwan (ASECL Product Change Notice PDF 183 KB
PCN13009 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li (ASECL), Taiwan and STATS ChipPAC (SCM) - Kuala Lump Product Change Notice PDF 173 KB
PCN12006 - Alternate Manufacturing Site for Assembly of the Listed Intersil QFN Packaged Products - STATS ChipPAC (SCM) - Kuala Lumpur, Malaysia Product Change Notice PDF 138 KB
PCN10083 - Alternate Bond Wire Material for Assembly of the Listed Intersil DFN/QFN Packaged Products - STATS ChipPAC Malaysia Product Change Notice PDF 79 KB
PCN10055 - Alternate Bond Wire Material for Assembly of the Listed Intersil DFN/QFN Packaged Products - STATS ChipPAC Malaysia Product Change Notice PDF 248 KB