The ISL6266 and ISL6266A are two-phase buck converter regulators implementing Intel® IMVP-6 protocol with embedded gate drivers. Both converters use interleaved channels to double the output voltage ripple frequency and thereby reduce output voltage ripple amplitude with fewer components, lower component cost, reduced power dissipation, and smaller real estate area. The ISL6266A utilizes the patented R3 Technology™, Intersil's Robust Ripple Regulator modulator. Compared with traditional multiphase buck regulators, the R3 Technology™ has the fastest transient response. This is due to the R3 modulator commanding variable switching frequency during load transient events. Intel Mobile Voltage Positioning (IMVP) is a smart voltage regulation technology, which effectively reduces power dissipation in Intel Pentium processors. To boost battery life, the ISL6266A supports DPRSLRVR (deeper sleep), DPRSTP# and PSI# functions, which maximizes efficiency by enabling different modes of operation. In active mode (heavy load), the regulator commands the two phase continuous conduction mode (CCM) operation. When PSI# is asserted in active mode (medium load), the ISL6266A operates in one-phase CCM. When the CPU enters deeper sleep mode, the ISL6266A enables diode emulation to maximize efficiency. For better system power management, the ISL6266A provides a CPU power monitor output. The analog output at the power monitor pin can be fed into an A/D converter to report instantaneous or average CPU power. A 7-bit digital-to-analog converter (DAC) allows dynamic adjustment of the core output voltage from 0. 300V to 1. 500V. Over-temperature, the ISL6266A achieves a 0. 5% system accuracy of core output voltage. A unity-gain differential amplifier is provided for remote CPU die sensing. This allows the voltage on the CPU die to be accurately measured and regulated per Intel IMVP-6+ specifications. Current sensing can be realized using either lossless inductor DCR sensing or discrete resistor sensing. A single NTC thermistor network thermally compensates the gain and the time constant of the DCR variations. The ISL6266 also includes all the functions for IMVP-6+ core power delivery. In addition, it has been optimized for use with coupled-inductor solutions.

Features

  • Precision Two/One-phase CORE Voltage Regulator
  • 0.5% System Accuracy Over-Temperature
  • Enhanced Load Line Accuracy
  • Internal Gate Driver with 2A Driving Capability
  • Dynamic Phase Adding/Dropping
  • Microprocessor Voltage Identification Input
  • 7-Bit VID Input
  • 0.300V to 1.500V in 12.5mV Steps
  • Support VID Change On-the-Fly
  • Multiple Current Sensing Schemes Supported
  • Lossless Inductor DCR Current Sensing
  • Precision Resistive Current Sensing
  • CPU Power Monitor
  • Thermal Monitor
  • User Programmable Switching Frequency
  • Differential Remote CPU Die Voltage Sensing
  • Static and Dynamic Current Sharing
  • Support All Ceramic Output with Coupled Inductor (ISL6266)
  • Overvoltage, Undervoltage and Overcurrent Protection
  • Pb-Free (RoHS Compliant)

Product Options

Part Number Part Status Pkg. Type Carrier Type MOQ Buy Sample
Active QFN Tube 43
Availability
Active QFN Reel 4000
Availability

Documentation & Downloads

Title Other Languages Type Format File Size Date
Datasheets & Errata
ISL6266, ISL6266A Datasheet Datasheet PDF 1.49 MB
Application Notes & White Papers
Five Easy Steps to Create a Multi-Load Power Solution White Paper PDF 846 KB
AN1684: Nonideality of Ground Application Note PDF 397 KB
AN1681: Grounding Techniques Application Note PDF 509 KB
PCNs & PDNs
PCN13064 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Carsem (CAS) Ipoh, Malaysia Product Change Notice PDF 151 KB
PCN13063 - Alternate Manufacturing Site for Assembly of the Listed Intersil DFN/QFN Packaged Products Product Change Notice PDF 145 KB
PCN13060 - Test Site Change for the Listed Intersil Products Product Change Notice PDF 223 KB
PCN13024B - Alternate Manufacturing Site for Assembly of the Listed Intersil DFN/QFN Packaged Products - Canceled for select products Product Change Notice PDF 243 KB
PCN13025B - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products Product Change Notice PDF 222 KB
PCN13025 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li , Taiwan and STATS ChipPAC (SCM) - Kuala Lumpur, Mal Product Change Notice PDF 106 KB
PCN13024 - Alternate Manufacturing Site for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering - Chung-Li, Taiwan (ASECL Product Change Notice PDF 183 KB
PCN13009 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li (ASECL), Taiwan and STATS ChipPAC (SCM) - Kuala Lump Product Change Notice PDF 173 KB
PCN10083 - Alternate Bond Wire Material for Assembly of the Listed Intersil DFN/QFN Packaged Products - STATS ChipPAC Malaysia Product Change Notice PDF 79 KB
PCN10055 - Alternate Bond Wire Material for Assembly of the Listed Intersil DFN/QFN Packaged Products - STATS ChipPAC Malaysia Product Change Notice PDF 248 KB
Other
PLC14051A - Product Discontinuance / Obsolescence Notification Product Life Cycle Notice PDF 124 KB
PA10059 - Data Sheet Specification Change for Intersil Product ISL6266* Product Advisory PDF 34 KB