The ISL6218 Single-Phase Buck PWM control IC, with integrated half bridge gate driver, provides a precision voltage regulation system for advanced Pentium-M microprocessors in notebook computers. This control IC also features both input voltage feed-forward and average current mode control for excellent dynamic response, Loss-less current sensing using MOSFET rDS(ON), and user selectable switching frequencies from 250kHz to 500kHz per phase. The ISL6218 includes a 6-bit digital-to-analog converter (DAC) that dynamically adjusts the CORE PWM output voltage from 0. 700V to 1. 708V in 16mV steps, and conforms to the Intel IMVP-IV™ mobile VID specification. The ISL6218 also has logic inputs to select Active, Deep Sleep and Deeper Sleep modes of operation. A precision reference, remote sensing and proprietary architecture with integrated processor-mode compensated Droop provides excellent static and dynamic CORE voltage regulation. Another feature of the ISL6218 IC controller is the internal PGOOD delay circuit that holds the PGOOD pin low for 3ms to 12ms after the VCCP and VCC_MCH regulators are within regulation. This PGOOD signal is masked during VID changes. Output overvoltage and undervoltage are monitored and result in the converter latching off and PGOOD signal being held low. The overvoltage and undervoltage thresholds are 112% and 84% of the VID, Deep or Deeper Sleep setpoint. Overcurrent protection features a 32 cycle overcurrent shutdown. PGOOD, Overvoltage, Undervoltage and Overcurrent provide monitoring and protection for the microprocessor and power system. The ISL6218 IC is available in a 38 Ld TSSOP and 40 Ld QFN package.

Features

  • IMVP-IV™ Compliant CORE Regulator
  • Single-Phase Power Conversion
  • "Loss-less" Current Sensing for Improved Efficiency and Reduced Board Area
  • Optional Discrete Precision Current Sense Resistor
  • Internal Gate Drive and Boot-Strap Diode
  • Precision CORE Voltage Regulation
  • 0.8% System Accuracy Over-temperature
  • 6-Bit Microprocessor Voltage Identification Input
  • Programmable "Droop" and CORE Voltage Slew Rate to Comply with IMVP-IV™ Specification
  • Discontinuous Mode Of Operation for Increased Light Load Efficiency in Deep and Deeper Sleep Mode
  • Direct Interface with System Logic (STP_CPU and DPRSLPVR) for Deep and Deeper Sleep Modes of Operation
  • Easily Programmable Voltage Setpoints for Initial "Boot", Deep Sleep and Deeper Sleep Modes
  • Excellent Dynamic Response
  • Combined Voltage Feed-Forward and Average Current Mode Control
  • Overvoltage, Undervoltage and Overcurrent Protection
  • Power-good Output with Internal Blanking During VID and Mode Changes
  • User Programmable Switching Frequency of 250kHz to 500kHz
  • Pb-Free Plus Anneal Available (RoHS Compliant)

Product Options

Part Number Part Status Pkg. Type Carrier Type MOQ Buy Sample
Active QFN Tube 50
Availability
Active QFN Reel 4000
Availability
Active TSSOP Tube 1000
Availability
Active TSSOP Tube 1000
Availability
Active TSSOP Reel 2500
Availability
Active TSSOP Reel 2500
Availability

Documentation & Downloads

Title Other Languages Type Format File Size Date
Datasheets & Errata
ISL6218 Datasheet Datasheet PDF 824 KB
Application Notes & White Papers
Five Easy Steps to Create a Multi-Load Power Solution White Paper PDF 846 KB
AN1681: Grounding Techniques Application Note PDF 509 KB
AN1684: Nonideality of Ground Application Note PDF 397 KB
PCNs & PDNs
PCN13064 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Carsem (CAS) Ipoh, Malaysia Product Change Notice PDF 151 KB
PCN13025B - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products Product Change Notice PDF 222 KB
PCN13025 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li , Taiwan and STATS ChipPAC (SCM) - Kuala Lumpur, Mal Product Change Notice PDF 106 KB
PCN13009 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li (ASECL), Taiwan and STATS ChipPAC (SCM) - Kuala Lump Product Change Notice PDF 173 KB
PCN11113A - Manufacturing Site Change for Assembly of the Listed Intersil TSSOP Packaged Products - Carsem-M (CAM) - Ipoh, Malaysia Product Change Notice PDF 121 KB
PCN11113 - Manufacturing Site Change for Assembly of the Listed Intersil TSSOP Packaged Products - Carsem-M (CAM) - Ipoh, Malaysia Product Change Notice PDF 120 KB
PCN10055 - Alternate Bond Wire Material for Assembly of the Listed Intersil DFN/QFN Packaged Products - STATS ChipPAC Malaysia Product Change Notice PDF 248 KB
Other
Industrial Power Management Brochure ( R16CL0001EJ0200 ) 日本語 Brochure PDF 3.13 MB
PLC14003A - Product Discontinuance / Obsolescence Notification Product Life Cycle Notice PDF 216 KB
PLC14003 - Product Discontinuance / Obsolescence Notification Product Life Cycle Notice PDF 179 KB