The ISL6605 is a high frequency, MOSFET driver optimized to drive two N-Channel power MOSFETs in a synchronous-rectified buck converter topology. This driver combined with an Intersil HIP63xx or ISL65xx Multiphase Buck PWM controller forms a complete single-stage core-voltage regulator solution with high efficiency performance at high switching frequency for advanced microprocessors. The IC is biased by a single low voltage supply (5V) and minimizes low driver switching losses for high MOSFET gate capacitance and high switching frequency applications. Each driver is capable of driving a 3000pF load with an 8ns propagation delay and less than 10ns transition time. This product implements bootstrapping on the upper gate with an internal bootstrap Schottky diode, reducing implementation cost, complexity, and allowing the use of higher performance, cost effective N-Channel MOSFETs. Adaptive shoot-through protection is integrated to prevent both MOSFETs from conducting simultaneously. The ISL6605 features 4A typical sink current for the lower gate driver, which is capable of holding the lower MOSFET gate during the Phase node rising edge to prevent shootthrough power loss caused by the high dv/dt of the Phase node. The ISL6605 also features a Three-State PWM input that, working together with Intersil Multiphase PWM controllers, will prevent a negative transient on the output voltage when the output is being shut down. This feature eliminates the Schottky diode that is usually seen in a microprocessor power system for protecting the microprocessor from reversed-output-voltage damage.

Features

  • Drives Two N-Channel MOSFETs
  • Adaptive Shoot-Through Protection
  • 0.4Ω On-Resistance and 4A Sink Current Capability
  • Supports High Switching Frequency
  • Fast Output Rise and Fall Time
  • Ultra Low Propagation Delay 8ns
  • Three-State PWM Input for Power Stage Shutdown
  • Internal Bootstrap Schottky Diode
  • Low Bias Supply Current (5V, 30µA)
  • Enable Input
  • QFN Package
  • Compliant to JEDEC PUB95 MO-220 QFN-Quad Flat No Leads-Product Outline.
  • Near Chip-Scale Package Footprint; Improves PCB Efficiency and Thinner in Profile.
  • Pb-Free Available (RoHS Compliant)

Applications

  • Core Voltage Supplies for Intel® and AMD® Microprocessors
  • High Frequency Low Profile DC-DC Converters
  • High Current Low Voltage DC-DC Converters
  • Synchronous Rectification for Isolated Power Supplies

Product Options

Part Number Part Status Pkg. Type Carrier Type MOQ Buy Sample
Active QFN Tube 100
Availability
Active QFN Reel 6000
Availability

Documentation & Downloads

Title Other Languages Type Format File Size Date
Datasheets & Errata
ISL6605 Datasheet Datasheet PDF 552 KB
User Guides & Manuals
AN1044: ISL6558EVAL2 User Guide Manual PDF 886 KB
Application Notes & White Papers
Five Easy Steps to Create a Multi-Load Power Solution White Paper PDF 846 KB
AN1681: Grounding Techniques Application Note PDF 509 KB
AN1684: Nonideality of Ground Application Note PDF 397 KB
AN1116: CMOS Applications Information Application Note PDF 576 KB
PCNs & PDNs
PCN15046 - Wafer Fabrication Site Change for Listed Intersil Products - Global Foundry P6 Process transfer to Palm Bay - Phase II Product Change Notice PDF 398 KB
PCN13064 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Carsem (CAS) Ipoh, Malaysia Product Change Notice PDF 151 KB
PCN13025B - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products Product Change Notice PDF 222 KB
PCN13026 - Alternate Manufacturing Site for Assembly of the Listed Intersil SOIC Packaged Products - Amkor Technology, Philippines (ATP) Product Change Notice PDF 77 KB
PCN13013 - Test Site Change for the Listed Intersil Products - Carsem (CAS) Ipoh Malaysia Product Change Notice PDF 207 KB
PCN13025 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li , Taiwan and STATS ChipPAC (SCM) - Kuala Lumpur, Mal Product Change Notice PDF 106 KB
PCN13009 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li (ASECL), Taiwan and STATS ChipPAC (SCM) - Kuala Lump Product Change Notice PDF 173 KB
PCN12068 - SOIC w/ Copper Bond Wire @ ASECL as Alternate Assembly Site Product Change Notice PDF 108 KB
PCN10055 - Alternate Bond Wire Material for Assembly of the Listed Intersil DFN/QFN Packaged Products - STATS ChipPAC Malaysia Product Change Notice PDF 248 KB
Other
PLC18018 - General Q3 Product Life Cycle Notice Product Life Cycle Notice PDF 388 KB
TB363: Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices (SMDs) Other PDF 293 KB
TB458: Converting a Fixed PWM to an Adjustable PWM Other PDF 315 KB
TB447: Guidelines for Preventing Boot-to-Phase Stress on Half-Bridge MOSFET Driver ICs Other PDF 264 KB