The ISL6609, ISL6609A is a high frequency, MOSFET driver optimized to drive two N-Channel power MOSFETs in a synchronous-rectified buck converter topology. This driver combined with an Intersil ISL63xx or ISL65xx multiphase PWM controller forms a complete single-stage core-voltage regulator solution with high efficiency performance at high switching frequency for advanced microprocessors. The IC is biased by a single low voltage supply (5V), minimizing driver switching losses in high MOSFET gate capacitance and high switching frequency applications. Each driver is capable of driving a 3nF load with less than 10ns rise/fall time. Bootstrapping of the upper gate driver is implemented via an internal low forward drop diode, reducing implementation cost, complexity, and allowing the use of higher performance, cost effective N-Channel MOSFETs. Adaptive shoot-through protection is integrated to prevent both MOSFETs from conducting simultaneously. The ISL6609, ISL6609A features 4A typical sink current for the lower gate driver, enhancing the lower MOSFET gate hold-down capability during PHASE node rising edge, preventing power loss caused by the self turn-on of the lower MOSFET due to the high dV/dt of the switching node. The ISL6609, ISL6609A also features an input that recognizes a high-impedance state, working together with Intersil multiphase PWM controllers to prevent negative transients on the controlled output voltage when operation is suspended. This feature eliminates the need for the schottky diode that may be utilized in a power system to protect the load from negative output voltage damage. In addition, the ISL6609A's bootstrap function is designed to prevent the BOOT capacitor from overcharging, should excessively large negative swings occur at the transitions of the PHASE node.

Features

  • Drives Two N-Channel MOSFETs
  • Adaptive Shoot-Through Protection
  • 0.4Ω On-Resistance and 4A Sink Current Capability
  • Supports High Switching Frequency
  • Fast Output Rise and Fall
  • Ultra Low Three-State Hold-Off Time (20ns)
  • ISL6605 Replacement with Enhanced Performance
  • BOOT Capacitor Overcharge Prevention (ISL6609A)
  • Low VF Internal Bootstrap Diode
  • Low Bias Supply Current
  • Enable Input and Power-On Reset
  • QFN Package
  • Compliant to JEDEC PUB95 MO-220 QFN-Quad Flat No Leads-Product Outline
  • Near Chip-Scale Package Footprint; Improves PCB Efficiency and Thinner in Profile
  • Pb-Free (RoHS Compliant)

Applications

  • Core Voltage Supplies for Intel® and AMD® Microprocessors
  • High Frequency Low Profile High Efficiency DC/DC Converters
  • High Current Low Voltage DC/DC Converters
  • Synchronous Rectification for Isolated Power Supplies

Product Options

Part Number Part Status Pkg. Type Carrier Type MOQ Buy Sample
Active QFN Tube 100
Availability
Active QFN Reel 6000
Availability

Documentation & Downloads

Title Other Languages Type Format File Size Date
Datasheets & Errata
ISL6609, ISL6609A Datasheet Datasheet PDF 1.32 MB
User Guides & Manuals
ISL6327EVAL5 User Guide Manual PDF 876 KB
Application Notes & White Papers
Five Easy Steps to Create a Multi-Load Power Solution White Paper PDF 846 KB
AN1684: Nonideality of Ground Application Note PDF 397 KB
AN1681: Grounding Techniques Application Note PDF 509 KB
AN1116: CMOS Applications Information Application Note PDF 576 KB
PCNs & PDNs
PCN13064 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Carsem (CAS) Ipoh, Malaysia Product Change Notice PDF 151 KB
PCN13025B - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products Product Change Notice PDF 222 KB
PCN13013 - Test Site Change for the Listed Intersil Products - Carsem (CAS) Ipoh Malaysia Product Change Notice PDF 207 KB
PCN13025 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li , Taiwan and STATS ChipPAC (SCM) - Kuala Lumpur, Mal Product Change Notice PDF 106 KB
PCN13009 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li (ASECL), Taiwan and STATS ChipPAC (SCM) - Kuala Lump Product Change Notice PDF 173 KB
PCN12068 - SOIC w/ Copper Bond Wire @ ASECL as Alternate Assembly Site Product Change Notice PDF 108 KB
PCN10055 - Alternate Bond Wire Material for Assembly of the Listed Intersil DFN/QFN Packaged Products - STATS ChipPAC Malaysia Product Change Notice PDF 248 KB
Other
PLC18018 - General Q3 Product Life Cycle Notice Product Life Cycle Notice PDF 388 KB
TB363: Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices (SMDs) Other PDF 293 KB
PA16061 - Introduce New T-type End Plug for n-SOIC rail (packing tube) Product Advisory PDF 106 KB
TB458: Converting a Fixed PWM to an Adjustable PWM Other PDF 315 KB