The ISL6612A and ISL6613A are high frequency MOSFET drivers specifically designed to drive upper and lower power N-Channel MOSFETs in a synchronous rectified buck converter topology. These drivers combined with HIP63xx or ISL65xx Multi-Phase Buck PWM controllers and N-Channel MOSFETs form complete core-voltage regulator solutions for advanced microprocessors. The ISL6612A drives the upper gate to 12V, while the lower gate can be independently driven over a range from 5V to 12V. The ISL6613A drives both upper and lower gates over a range of 5V to 12V. This drive-voltage provides the flexibility necessary to optimize applications involving trade-offs between gate charge and conduction losses. An advanced adaptive zero shoot-through protection is integrated to prevent both the upper and lower MOSFETs from conducting simultaneously and to minimize the dead time. These products add an overvoltage protection feature operational before VCC exceeds its turn-on threshold, at which the PHASE node is connected to the gate of the low side MOSFET (LGATE). The output voltage of the converter is then limited by the threshold of the low side MOSFET, which provides some protection to the microprocessor if the upper MOSFET(s) is shorted during initial startup. These drivers also feature a three-state PWM input which, working together with multi-phase PWM controllers, prevents a negative transient on the output voltage when the output is shut down. This feature eliminates the Schottky diode that is used in some systems for protecting the load from reversed output voltage events.

Features

  • Pin-to-pin Compatible with HIP6601 SOIC family
  • Dual MOSFET Drives for Synchronous Rectified Bridge
  • Advanced Adaptive Zero Shoot-Through Protection
    • Body Diode Detection
    • Auto-zero of rDS(ON) Conduction Offset Effect
  • Adjustable Gate Voltage (5V to 12V) for Optimal Efficiency
  • 36V Internal Bootstrap Schottky Diode
  • Bootstrap Capacitor Overcharging Prevention
  • Supports High Switching Frequency (up to 2MHz)
    • 3A Sinking Current Capability
    • Fast Rise/Fall Times and Low Propagation Delays
  • Three-State PWM Input for Output Stage Shutdown
  • Three-State PWM Input Hysteresis for Applications with Power Sequencing Requirement
  • Pre-POR Overvoltage Protection
  • VCC Undervoltage Protection
  • Expandable Bottom Copper Pad for Enhanced Heat Sinking
  • Dual Flat No-Lead (DFN) Package
    • Near Chip-Scale Package Footprint; Improves PCB Efficiency and Thinner in Profile
  • Pb-Free (RoHS Compliant)

Applications

  • Core Regulators for Intel® and AMD® Microprocessors
  • High Current DC/DC Converters
  • High Frequency and High Efficiency VRM and VRD

Product Options

Part Number Part Status Pkg. Type Carrier Type MOQ Buy Sample
Active SOICN Tube 980
Availability
Active SOICN Reel 2500
Availability
Active SOICN Reel 2500
Availability
Active SOICN Tube 980
Availability
Active SOICN Reel 2500
Availability

Documentation & Downloads

Title Other Languages Type Format File Size Date
Datasheets & Errata
ISL6612A, ISL6613A Datasheet Datasheet PDF 696 KB
User Guides & Manuals
ISL6334EVAL1Z User Guide Manual PDF 2.35 MB
Application Notes & White Papers
Five Easy Steps to Create a Multi-Load Power Solution White Paper PDF 846 KB
AN1681: Grounding Techniques Application Note PDF 509 KB
AN1684: Nonideality of Ground Application Note PDF 397 KB
AN1116: CMOS Applications Information Application Note PDF 576 KB
PCNs & PDNs
PCN15046 - Wafer Fabrication Site Change for Listed Intersil Products - Global Foundry P6 Process transfer to Palm Bay - Phase II Product Change Notice PDF 398 KB
PCN14036 - Wafer fabrication Site Change for Listed Intersil Products - Palm Bay, Florida Product Change Notice PDF 294 KB
PCN13025B - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products Product Change Notice PDF 222 KB
PCN13025 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li , Taiwan and STATS ChipPAC (SCM) - Kuala Lumpur, Mal Product Change Notice PDF 106 KB
PCN13009 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li (ASECL), Taiwan and STATS ChipPAC (SCM) - Kuala Lump Product Change Notice PDF 173 KB
PCN12068 - SOIC w/ Copper Bond Wire @ ASECL as Alternate Assembly Site Product Change Notice PDF 108 KB
PCN12026 - Alternate Manufacturing Site for Assembly of the Listed Intersil 8-Lead SOIC Packaged Products Product Change Notice PDF 140 KB
PCN10055 - Alternate Bond Wire Material for Assembly of the Listed Intersil DFN/QFN Packaged Products - STATS ChipPAC Malaysia Product Change Notice PDF 248 KB
PCN10047 - Alternate Manufacturing Site for Assembly of the Listed Intersil 8l EpSOIC Packaged Products - ANST (Wuxi CR Micro-Assembly Technology Ltd.) Product Change Notice PDF 51 KB
Other
PLC18018 - General Q3 Product Life Cycle Notice Product Life Cycle Notice PDF 388 KB
TB363: Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices (SMDs) Other PDF 293 KB
PA16061 - Introduce New T-type End Plug for n-SOIC rail (packing tube) Product Advisory PDF 106 KB
PA14042 - Minimum Line Quantity Change Product Advisory PDF 363 KB
PA12030 - Data Sheet Specification Correction for the Listed Intersil EPSOIC Packaged Products Product Advisory PDF 226 KB
TB458: Converting a Fixed PWM to an Adjustable PWM Other PDF 315 KB
TB417: Designing Stable Compensation Networks for Single Phase Voltage Mode Buck Regulators Other PDF 562 KB