The ISL6614A integrates two ISL6613A MOSFET drivers and is specifically designed to drive two Channel MOSFETs in a synchronous rectified buck converter topology. These drivers combined with HIP63xx or ISL65xx Multiphase Buck PWM controllers and N-Channel MOSFETs form complete corevoltage regulator solutions for advanced microprocessors. The ISL6614A drives both the upper and lower gates simultaneously over a range from 5V to 12V. This drivevoltage provides the flexibility necessary to optimize applications involving trade-offs between gate charge and conduction losses. An advanced adaptive zero shoot-through protection is integrated to prevent both the upper and lower MOSFETs from conducting simultaneously and to minimize the dead time. These products add an overvoltage protection feature operational before VCC exceeds its turn-on threshold, at which the PHASE node is connected to the gate of the low side MOSFET (LGATE). The output voltage of the converter is then limited by the threshold of the low side MOSFET, which provides some protection to the microprocessor if the upper MOSFET(s) is shorted during startup. The ISL6614A also features a three-state PWM input which, working together with Intersil's Multiphase PWM controllers, prevents a negative transient on the output voltage when the output is shut down. This feature eliminates the Schottky diode that is used in some systems for protecting the load from reversed output voltage events.

Features

  • Pin-to-pin Compatible with HIP6602 SOIC family
  • Quad N-Channel MOSFET Drives for Two Synchronous Rectified Bridges
  • Advanced Adaptive Zero Shoot-Through Protection
  • Body Diode Detection
  • Auto-zero of rDS(ON) Conduction Offset Effect
  • Adjustable Gate Voltage (5V to 12V) for Optimal Efficiency
  • Internal Bootstrap Schottky Diode
  • Bootstrap Capacitor Overcharging Prevention
  • Supports High Switching Frequency (up to 1MHz)
  • 3A Sinking Current Capability
  • Fast Rise/Fall Times and Low Propagation Delays
  • Three-State PWM Input for Output Stage Shutdown
  • Three-State PWM Input Hysteresis for Applications With Power Sequencing Requirement
  • Pre-POR Overvoltage Protection
  • VCC Undervoltage Protection
  • Expandable Bottom Copper Pad for Enhanced Heat Sinking
  • QFN Package:
  • Compliant to JEDEC PUB95 MO-220 QFN - Quad Flat No Leads - Package Outline
  • Near Chip Scale Package footprint, which improves PCB efficiency and has a thinner profile
  • Pb-Free Plus Anneal Available (RoHS Compliant)

Applications

  • Core Regulators for Intel® and AMD® Microprocessors
  • High Current DC-DC Converters
  • High Frequency and High Efficiency VRM and VRD

Product Options

Part Number Part Status Pkg. Type Carrier Type MOQ Buy Sample
Active SOICN Tube 1000
Availability
Active SOICN Reel 2500
Availability
Last Time Buy QFN Tube 75
Availability
Last Time Buy QFN Reel 6000
Availability

Documentation & Downloads

Title Other Languages Type Format File Size Date
Datasheets & Errata
ISL6614A Datasheet Datasheet PDF 660 KB
Application Notes & White Papers
Five Easy Steps to Create a Multi-Load Power Solution White Paper PDF 846 KB
AN1681: Grounding Techniques Application Note PDF 509 KB
AN1684: Nonideality of Ground Application Note PDF 397 KB
AN1116: CMOS Applications Information Application Note PDF 576 KB
AN1442: Powering AMD Uni-Plane and Split-Plane Processors with the ISL6323 Application Note PDF 1.93 MB
PCNs & PDNs
PCN14036 - Wafer fabrication Site Change for Listed Intersil Products - Palm Bay, Florida Product Change Notice PDF 294 KB
PCN13025 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li , Taiwan and STATS ChipPAC (SCM) - Kuala Lumpur, Mal Product Change Notice PDF 106 KB
PCN13009 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li (ASECL), Taiwan and STATS ChipPAC (SCM) - Kuala Lump Product Change Notice PDF 173 KB
PCN12068 - SOIC w/ Copper Bond Wire @ ASECL as Alternate Assembly Site Product Change Notice PDF 108 KB
PCN10055 - Alternate Bond Wire Material for Assembly of the Listed Intersil DFN/QFN Packaged Products - STATS ChipPAC Malaysia Product Change Notice PDF 248 KB
Other
PLC20016 - End of Life Notice Product Life Cycle Notice PDF 220 KB
PA16061 - Introduce New T-type End Plug for n-SOIC rail (packing tube) Product Advisory PDF 106 KB
TB458: Converting a Fixed PWM to an Adjustable PWM Other PDF 315 KB